MAPstation Workstations

MAPstation workstations utilize MAP® processors, SNAP interconnect, the Hi-Bar® switch, and Multi-Ported Common Memory to put the processing power of hundreds of microprocessors in a single workstation.

 

MAPstation users will soon have a choice of which microprocessor best suits their needs: Intel EM64T microprocessors or AMD's Opteron processors. Opteron processors are being offered under AMD's Torrenza Initiative. All AMD-based systems will still use the SRC® SNAP high performance commodity processor interface and will be software compatible with all other SRC systems.

 

Features & Benefits

  • The performance of large multiprocessor server racks in a single desktop chassis
  • Orders of magnitude more performance per processor than current high performance microprocessors through the SRC IMPLICIT+EXPLICIT Architecture
  • Available single and multi-MAP processor configurations in tower, tower rack-mountable and 2U rack-mountable form-factors
  • Utilizing Carte software tools, codes can be developed on a MAPstation workstation and then put into production use on an SRC scalable system or embedded solution

 

More Information

Download product sheets:

 

How to Buy

 

MAPstation Specifications

 

SRC-7

CPU Intel: 3.0 GHz dual Xeon EMT-64 enabled processor
AMD: 3.0GHz Opteron 200 Series
      Cache Intel: 16K L1 trace cache, 2 MB L2 cache per processor
AMD: 64K L1 Data/Instuction, 1MB L2 cache per processor
      FLOPS Intel: 12 GFLOPS theoretical peak performance (@3.0 GHz)
AMD: 24 GFLOPs theoretical peak performance (@3.0 GHz)
      SMP Intel: 2-way SMPs per chassis
AMD: 4-way (2 socket with Dual processors) SMP per chassis
      CPU Memory Intel: Up to 12 GB PC2700 (DDR 333) Registered ECC SDRAM per chassis
AMD: Up to 32 GB PC2700 (DDR 33) Registered ECC SDRAM
      Memory Bandwidth Intel: 5.4 GB/s per SMP
AMD: 5.4GB/s per Socket
Interconnect SNAP Series D memory interconnect 
(view SNAP specs)
7.2 GB/s sustained MAP payload bandwidth per port
MAP Processors Series H MAP (view specs)    
Series C Multi-Ported Common Memory Supports SNAP interconnect and up to 3 MAP processors, 2 Common Memory Banks on board
Up to 8 GB PC4200 (DDRII 533) Registered ECC SDRAM per bank - 2 banks per assembly
Tower External I/O Intel: 2-8 lane PCI-Express 1-PCI 32 BIT 66 MHz
         2-PCI-X 64 Bit 133
         2-Ultra 320 SCSI
         Dual Port Gigabit Ethernet
         2-PCI-X 64 BIT 100 MHz
AMD: 2-8 lane PCI-Express 1-PCI 32bit 66 MHZ
          3-PCI-X 64 Bit 133 MHZ
          Dual Port Gigabit Ethernet
2U External I/O Intel: Requires the use of low profile cards
        2-8 lane PCI-Express
        1-PCI 32 BIT 66 MHz
        2-PCI-X 64 Bit 133 2-Ultra 320 SCSI
        Dual Port Gigabit Ethernet
        2-PCI-X 64 BIT 100 MHz
AMD: Same as above
Disk 3.5 inch Serial ATA drives (500 GB 7200 RPM)
DVDRW 18x
MTBF (Khours) 97 for normal operation
20 for system maintenance devices
Operating System Fedora Linux
File Systems ext3
Compilers Intel C++, Intel Fortran, SRC Carte™ Programming Environment
Power 1000 W max
Physical Specifications – Tower 
   Dimensions Height: 17.00 in. (43.18 cm)
Width: 8.80 in. (22.35 cm)
Depth: 24.00 in. (60.96 cm)
   Weight 45 lbs (20 kg)
   Cooling Air cooled
   Operating Ambient
     Temperature
41o to 95o F
(5o to 35o C)

   Non-Operating 
   Temperature

-4o to 140o F
(-20o to 60o C)
   Operating Relative 
   Humidity
15 to 80%
Physical Specifications – 2U 
     Dimensions Height: 3.50 in. (8.89 cm)
Width: 17.00 in. (43.18 cm)
Depth: 26.00 in. (66.04 cm)
     Weight 40 lbs (18 kg)
     Cooling Air cooled
     Operating Ambient
     Temperature
41o to 95o F
(5o to 35o C)
     Non-Operating
     Temperature
-4o to 140o F
(-20o to 60o C)
     Operating Relative 
     Humidity
15 to 80%

SRC Computers reserves the right to update these specifications at any time.

 

back to top