MAPstation™ Workstations
MAPstations utilize MAP® processors, SNAP™ interconnect, Hi-Bar® switch, and Common Memory to put the processing power of hundreds of microprocessors in a single workstation.
MAPstation users will soon have a choice of which microprocessor best suits their needs: Intel EM64T microprocessors or AMD's Opteron processors. Opteron processors are being offered under AMD's Torrenza Initiative. All AMD-based systems will still use SRC's SNAP high performance commodity processor interface and will be software compatible with all other SRC systems.
Features & Benefits
- The performance of large multiprocessor server racks in a single desktop chassis
- Orders of magnitude more performance per processor than current high performance microprocessors through SRC’s IMPLICIT+EXPLICIT™ Architecture
- Available in tower, tower rack-mountable and 2U rack-mountable configurations
- Utilizing Carte™ software tools, codes can be developed on a MAPstation and then put into production use on an SRC scalable system or embedded solution
More Information
Download product sheets:
MAPstation Specifications
|
|
SRC-7 |
SRC-6 |
| CPU |
Intel: 3.0 GHz dual Xeon EMT-64
enabled processor AMD: 3.0GHz Opteron 200 Series |
Intel: 3.0 GHz dual Xeon EMT-64 enabled processor |
| Cache |
Intel: 16K L1 trace cache, 2 MB L2
cache per processor AMD: 64K L1 Data/Instuction, 1MB L2 cache per processor |
Intel: 16K L1 trace cache, 2 MB L2 cache per processor |
| FLOPS |
Intel: 12 GFLOPS theoretical
peak performance (@3.0 GHz) AMD: 24 GFLOPs theoretical peak performance (@3.0 GHz) |
Intel: 12 GFLOPS theoretical peak performance (@3.0 GHz) |
| SMP |
Intel: 2-way SMPs per chassis AMD: 4-way (2 socket with Dual processors) SMP per chassis |
Intel: 2-way SMPs per chassis |
| CPU Memory |
Intel: Up to 12 GB PC2700 (DDR
333) Registered ECC SDRAM per chassis AMD: Up to 32 GB PC2700 (DDR 33) Registered ECC SDRAM |
Intel: Up to 12 GB PC2700 (DDR 333) Registered ECC SDRAM per chassis |
| Memory Bandwidth |
Intel: 5.4 GB/s per SMP AMD: 5.4GB/s per Socket |
Intel: 5.4 GB/s per SMP |
| Interconnect |
SNAP™ Series D memory interconnect to MAP (view SNAP specs) 7.2 GB/s sustained MAP payload bandwidth per port |
SNAP Series E memory interconnect to MAP (view SNAP specs) 2.8 GB/s sustained MAP payload bandwidth per port |
| MAP | Series H MAP (view MAP specs) | Series E MAP (view MAP specs) |
| Hi-Bar Switch |
Available in tower only Series D six-port crossbar (view Hi-Bar specs) Supports 3 MAP or Common Memory Nodes 2 Common Memory Banks on-board |
Available in tower only Series A four-port crossbar (view Hi-Bar specs) Supports 3 MAP or Common Memory Nodes |
| Common Memory |
Series C Common Memory Up to 8 GB PC4200 (DDRII 533) Registered ECC SDRAM per bank - 2 banks per assembly |
Series B Common Memory Up to 16 GB/s per bank |
| Tower External I/O |
Intel: 2-8 lane PCI-Express
1-PCI 32 BIT 66 MHz 2-PCI-X 64 Bit 133 2-Ultra 320 SCSI Dual Port Gigabit Ethernet 2-PCI-X 64 BIT 100 MHz AMD: 2-8 lane PCI-Express 1-PCI 32bit 66 MHZ 3-PCI-X 64 Bit 133 MHZ Dual Port Gigabit Ethernet |
Intel:
6 PCI-X bus slots on 3 buses Dual Port Gigabit Ethernet |
| 2U External I/O |
Intel: Requires the use of low profile
cards
2-8 lane PCI-Express 1-PCI 32 BIT 66 MHz 2-PCI-X 64 Bit 133 2-Ultra 320 SCSI Dual Port Gigabit Ethernet 2-PCI-X 64 BIT 100 MHz AMD: Same as above |
Intel: 3 PCI-X bus slots on 3
buses Dual Port Gigabit Ethernet |
| Disk | 3.5 inch Serial ATA drives (500 GB 7200 RPM) | 3.5 inch Serial ATA drives (500 GB 7200 RPM) |
| DVDRW | 18x | 18x |
| MTBF (Khours) |
97 for normal operation
20 for system maintenance devices |
97 for normal operation 20 for system maintenance devices |
| Operating System | Fedora Linux | Fedora Linux |
| File Systems | ext3 |
ext3 |
| Compilers | Intel C++, Intel Fortran, SRC Carte™ | Intel C++, Intel Fortran, SRC Carte™ |
| Power | 1000 W max | 500 W max |
| Physical Specifications – Tower | ||
| Dimensions |
Height: 17.00 in. (43.18 cm) Width: 8.80 in. (22.35 cm) Depth: 24.00 in. (60.96 cm) |
Height: 17.00 in. (43.18 cm) Width: 8.80 in. (22.35 cm) Depth: 24.00 in. (60.96 cm) |
| Weight | 45 lbs (20 kg) | 45 lbs (20 kg) |
| Cooling | Air cooled | Air cooled |
|
Operating Ambient Temperature |
41o to 95o F (5o to 35o C) |
50o to
95o F
(10o to 35o C) |
|
Non-Operating |
-4o to 140o F (-20o to 60o C) |
-4o to
140o F
(-20o to 60o C) |
|
Operating Relative Humidity |
15 to 80% | 15 to 80% |
| Physical Specifications – 2U | ||
| Dimensions |
Height: 3.50 in. (8.89 cm) Width: 17.00 in. (43.18 cm) Depth: 26.00 in. (66.04 cm) |
Height: 3.50 in. (8.89 cm) Width: 17.00 in. (43.18 cm) Depth: 26.00 in. (66.04 cm) |
| Weight | 40 lbs (18 kg) | 40 lbs (18 kg) |
| Cooling | Air cooled | Air cooled |
|
Operating Ambient Temperature |
41o to 95o F (5o to 35o C) |
50o to
95o F
(10o to 35o C) |
|
Non-Operating Temperature |
-4o to 140o F (-20o to 60o C) |
-4o to
140o F
(-20o to 60o C) |
|
Operating Relative Humidity |
15 to 80% | 15 to 80% |
SRC reserves the right to update these specifications at any time.