SRC® Hardware Specifications -- MAP® processors, SNAP™ interconnects, Hi-Bar® switches, Multi-Ported Common Memory MPCM

SRC^® Hardware Specifications

Multi-Ported Common Memory (MPCM) Specifications

MAP^® Processor Specifications

	MAP Processor Series
	H
	SRC-7 MAPstation™ Workstations, Systems & Servers
Logic
User Logic Chips	EP2S180
Control Logic Chip	EP2S130
Nominal Clock Rate (MHz)	150
Total User Logic Reconfiguration Time (ms)	100
On-Board Memory (OBM)
# On-Board-Memory Banks - Logical	16
# On-Board-Memory Banks - Physical	8
Total OBM Bandwidth (BW) (Gbytes/s)	19.2
OBM BW to User Logic (Gbytes/s)	19.2
OBM BW to Control Logic (Gbytes/s)	7.2
OBM Bank Width (bits)	64
Total Simultaneous OBM Accesses (reads or writes)	16
Simultaneous User Logic OBM Accesses (reads or writes)	16
Total OBM Size (Mbytes)	64
Bridge Port BW (Gbytes/s)	4.8
On-Board Common Memory (OBCM)
# On-Board-Memory Banks	2
Total OBM Bandwidth (BW) (Gbytes/s)	8.4
OBM Bank Width (bits)	64
Total Simultaneous OBM Accesses (reads or writes)	2
Total OBM Size (Mbytes)	1024-2048
MAP Processor to System Interconnect
Sustained MAP Input Payload BW from System (Gbytes/s)	7.2
Sustained MAP Output Payload BW to System (Gbytes/s)	7.2
Simultaneous Sustained MAP Payload I/O BW to and from System (Gbytes/s)	14.4
General Purpose I/O (GPIO)
Number of GPIO Ports per MAP Processor	1 or 2
GPIO Signal Level Standards	2.5VTTL/ LVDS
# Signal Paths per GPIO Port	96/48
Sustainable GPIO BW per Port (Gbytes/s)	4.8/6.0
Maximum Data Rate per Signal Path (Mbits/s)	600/1000
GPIO Interconnect Medium	User Determined
Physical Specifications
Power Supply Voltage	+12vdc
Maximum Power Consumption (watts)	80
Form Factor	5.25
Cooling Methodology	Air
MTBF (Khours)	195

Series C, D, E, F, and G MAP modules are no longer available.

SRC Computers reserves the right to update these specifications at any time.

SNAP^™ Interface Specifications

	SNAP Interface Series
	D	E
		SRC-7 Systems & Servers	SRC-6 64 bit MAPstation Workstations, Systems & Servers
Port Configuration
# Input Ports	1	1
# Output Ports	1	1
Memory Bus Width (bits)	144	144
Interleaved Memory Bus	Yes	Yes
SECDED Error Correction Code on Memory Bus	Yes	Yes
SECDED Error Correction Code	Yes	Yes
Bandwidth (BW)
Interconnect Clock Rate (MHz)	1000	100
# Signal Paths per Port	36	72
Maximum Data Rate per Signal Path (Mb/s)	1000	200
Sustainable Payload BW per Port (Gbytes/s)	3.6	1.4
Aggregate Sustainable I/O Port Payload BW (Gbytes/s)	7.2	2.8
Memory Bus Clock Rate (MHz)	133	133
Physical Specifications
Maximum Power Consumption (watts)	TBD	TBD
Form Factor	Pi	Pi
Interconnect Medium	Coax Ribbon	Coax Ribbon
Cooling Methodology	Air	Air
MTBF (Khours)	97	97

Series B and C SNAP Interfaces are no longer available.

SRC Computers reserves the right to update these specifications at any time.

Hi-Bar^® Network Switch Specifications

	Hi-Bar Series
	C
Port Configuration
# Input Ports	16
# Output Ports	16
# Common Memory Ports	0
SECDED Error Correction Code	Yes
Bandwidth (BW)
Nominal Clock Rate (MHz)	166
# Signal Paths per Port	36
Maximum Data Rate per Signal Path (Mb/s)	1000
Sustainable Payload BW per I/O Port (Gbytes/s)	3.6
Aggregate Sustainable Payload BW (Gbytes/s)	115.2
Physical Specifications
Power Supply Voltage	120vac
Maximum Power Consumption (watts)	107
Form Factor	1U
Interconnect Medium	Coax Ribbon
Cooling Methodology	Air
MTBF (Khours)	97.25

Series A and B Hi-Bar Switches are no longer available. The Series D Hi-Bar Switch is now called
Multi-Ported Common Memory (MPCM) module. Please see the MPCM specifications below.

SRC Computers reserves the right to update these specifications at any time.

Multi-Ported Common Memory (MPCM) Specifications

View MPCM processor information

Download product sheet

Dimensions

1.75”H x 5.85”W x 9.5”D
(4.44 cm H x 14.86 cm W x 24.13 cm D)

# banks per MPCM module

2

DDR2 slots/bank

2

SDRAM volume per bank

16 Gbytes

I/O ports

4

Sustained DMA bandwidth per port

3.6 Gbytes/s

SRC Computers reserves the right to update these specifications at any time.