SRC® Hardware Specifications
MAP® Processor
Specifications
APM Processor Module Specifications
SNAP™ Interface Specifications
Hi-Bar®Network Switch Specifications
Multi-Ported Common Memory (MPCM) Specifications
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MAP® Processor
Specifications
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MAP Processor Series
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H
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Logic
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User Logic Chips
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EP2S180
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Control Logic Chip
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EP2S130
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Nominal Clock Rate (MHz)
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150
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Total User Logic
Reconfiguration Time
(ms)
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100
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On-Board
Memory (OBM)
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# On-Board-Memory Banks
- Logical
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16
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# On-Board-Memory
Banks
- Physical
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8
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Total OBM Bandwidth (BW) (Gbytes/s)
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19.2
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OBM BW to User Logic (Gbytes/s)
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19.2
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OBM BW to Control Logic (Gbytes/s)
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7.2
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OBM Bank Width (bits)
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64
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Total
Simultaneous OBM Accesses
(reads or writes)
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16
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Simultaneous
User Logic OBM Accesses
(reads or writes)
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16
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Total OBM Size (Mbytes)
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64
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Bridge Port BW (Gbytes/s)
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4.8
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On-Board
Common Memory (OBCM)
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# On-Board-Memory Banks
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2
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Total OBM Bandwidth (BW) (Gbytes/s)
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8.4
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OBM Bank Width (bits)
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64
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Total
Simultaneous OBM Accesses
(reads or writes)
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2
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Total OBM Size (Mbytes)
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1024-2048
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MAP
Processor to System Interconnect
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Sustained MAP Input Payload BW from System (Gbytes/s)
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7.2
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Sustained MAP Output Payload BW to System (Gbytes/s)
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7.2
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Simultaneous Sustained MAP Payload I/O BW to and from System
(Gbytes/s)
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14.4
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General Purpose I/O
(GPIO)
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Number of GPIO Ports per MAP
Processor
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1 or
2
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GPIO Signal Level Standards
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2.5VTTL/
LVDS
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# Signal Paths per GPIO Port
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96/48
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Sustainable GPIO BW per Port
(Gbytes/s)
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4.8/6.0
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Maximum Data Rate per Signal Path
(Mbits/s)
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600/1000
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GPIO Interconnect Medium
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User Determined
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Physical Specifications
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Power Supply Voltage
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+12vdc
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Maximum Power Consumption (watts)
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80
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Form Factor
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5.25
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Cooling Methodology
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Air
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MTBF
(Khours)
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195
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Series C, D, E, F, and G MAP
processors are no longer available.
SRC Computers reserves the right to update
these specifications at any time.
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APM Processor Specifications
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CPU
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Intel
1.6 GHz Atom Processor, Z530
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Front
Side Bus
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400
MHz
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Cache
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L1
32 KB instruction / 24 KB data cache, 512 KB L2 advanced
transfer cache
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FLOPS
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2.92
GFLOPS theoretical peak performance (@1.46 GHz)
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CPU
Memory
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2
GB DDR2 400
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Memory
Bandwidth
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3.6
GB/s
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Microprocessor-to-MAP®
Processor Interconnect
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Patented
SNAP™ interconnect to the MAP processor
Interconnect payload bandwidth per port SNAP
interconnect to MAP processor
- TBD
Aggregate payload bandwidth between the SNAP
interconnect and the MAP processor
- TBD
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Disk
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One
ESATA 150 (for external drive)
with optional encryption capability
One
120 GB, 5400 RPM 1.8” SATA 150 non-encrypted hard drive
Either
or both can be replaced with an Solid State Drive
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External
I/O
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Serial
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2-
USB 2.0
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Network
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1-Gigabit
Ethernet
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Video
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1-HDMI
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Peripheral
Cards Slot
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1-XMC
card slot (VITA
42.3, PCIe X1 lane)
1-SDHC card slot
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MTBF
(Khours)
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TBD
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Operating
System
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Fedora
Linux
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File
Systems
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ext3
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Compilers
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Intel
C++, Intel Fortran, SRC Carte™
Programming Environment
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Power
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+12VDC
(+2V/-1V), 20W Max
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SRC Computers reserves the right to update
these specifications at any time.
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SNAP™ Interface Specifications
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SNAP
Interface Series
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D
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E
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SRC-7 Systems &
Servers
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SRC-6 64 bit MAPstation
Workstations, Systems & Servers
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Port
Configuration
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#
Input Ports
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1
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1
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#
Output Ports
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1
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1
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Memory
Bus Width
(bits)
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144
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144
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Interleaved
Memory Bus
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Yes
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Yes
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SECDED
Error Correction Code on Memory Bus
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Yes
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Yes
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SECDED
Error Correction Code
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Yes
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Yes
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Bandwidth
(BW)
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Interconnect
Clock Rate (MHz)
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1000
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100
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#
Signal Paths per Port
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36
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72
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Maximum
Data Rate per Signal Path (Mb/s)
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1000
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200
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Sustainable
Payload BW per Port (Gbytes/s)
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3.6
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1.4
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Aggregate
Sustainable I/O Port Payload BW (Gbytes/s)
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7.2
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2.8
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Memory
Bus Clock Rate (MHz)
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133
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133
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Physical
Specifications
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Maximum
Power Consumption (watts)
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TBD
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TBD
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Form
Factor
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Pi
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Pi
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Interconnect
Medium
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Coax Ribbon
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Coax Ribbon
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Cooling
Methodology
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Air
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Air
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MTBF
(Khours)
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97
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97
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Series B and C SNAP Interfaces are no longer available.
SRC Computers reserves the right to update these specifications at any time.
back to top
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Hi-Bar® Network Switch Specifications
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Hi-Bar
Series
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C
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Port
Configuration
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#
Input Ports
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16
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#
Output Ports
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16
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#
Common Memory Ports
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0
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SECDED
Error Correction Code
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Yes
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Bandwidth
(BW)
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Nominal Clock Rate
(MHz)
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166
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# Signal Paths per
Port
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36
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Maximum Data Rate
per Signal Path
(Mb/s)
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1000
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Sustainable
Payload BW per I/O Port
(Gbytes/s)
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3.6
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Aggregate
Sustainable Payload BW
(Gbytes/s)
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115.2
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Physical
Specifications
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Power
Supply Voltage
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120vac
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Maximum Power
Consumption (watts)
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107
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Form Factor
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1U
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Interconnect
Medium
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Coax
Ribbon
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Cooling
Methodology
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Air
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MTBF
(Khours)
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97.25
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Series A and B Hi-Bar Switches are no longer available. The Series D Hi-Bar Switch is now called
Multi-Ported Common Memory (MPCM) module. Please see the MPCM
specifications below.
SRC Computers reserves the right to update these specifications at any time.
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Multi-Ported
Common Memory (MPCM) Specifications
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Dimensions
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1.75”H
x 5.85”W x 9.5”D
(4.44 cm H x
14.86 cm W x 24.13 cm D)
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#
banks per MPCM module
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2
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DDR2
slots/bank
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2
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SDRAM
volume per bank
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16
Gbytes
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I/O
ports
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4
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Sustained
DMA bandwidth per port
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3.6
Gbytes/s
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SRC Computers reserves the right to update these specifications at any time.
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